Semiconductor package including a detection pattern and method of fabricating the same

A semiconductor package, comprising:

• a first semiconductor die having a first width;
• a second semiconductor die on the first semiconductor die, the second semiconductor die having a second width that is smaller than the first width;
• and
• a mold layer at least partially covering
• a side surface of the second semiconductor die, and
• a top surface of the first semiconductor die,
• wherein the second semiconductor die comprises at least one detection pattern that is on a top surface of the second semiconductor die.

A semiconductor package, comprising:

• a first semiconductor die having a first width and comprising first connection pads that are in an upper portion of the first semiconductor die;
• outer connection terminals that are bonded to a bottom surface of the first semiconductor die;
• a second semiconductor die on the first semiconductor die, the second semiconductor die having a second width that is smaller than the first width and comprising second connection pads, the second connection pads located at a lower end of the second semiconductor die and in contact with the first connection pads, respectively;
• and
• a mold layer at least partially covering a side surface of the second semiconductor die and a top surface of the first semiconductor die,
• wherein the first semiconductor die comprises at least one first detection pattern that is on the top surface of the first semiconductor die and is in contact with a bottom surface of the mold layer,
• a reflectance of the first detection pattern is different from a reflectance of the top surface of the first semiconductor die, and
• the first detection pattern has a triangular, trapezoidal, or rectangular section.