Optical sensor package and method of manufacturing the same

Abstract

An optical sensor package includes a light-emitting unit disposed on a package substrate and configured to emit first light toward a target, a light-receiving unit disposed on the package substrate and configured to receive second light obtained when the first light is reflected from the target, and a molding member formed on the package substrate to surround a top surface of an exposed portion of the package substrate, the light-emitting unit, and the light-receiving unit, the molding member including a groove formed in a thickness direction between the light-emitting unit and the light-receiving unit, wherein the groove is filled with an opaque material.

Dependencies are inferred from the claim text.