Circuit and method for interconnect test

A circuit, comprising:

• a first die;
• a second die;
• and
• at least one interconnect configured to operatively couple the first die to the second die;
• wherein, during a first operation stage, the first die is configured to provide control data indicating a test type to the second die based on a first frequency;
• wherein, during a second operation stage following the first operation stage, the first die is configured to provide test data to the second die based on a second frequency, the second frequency being substantially higher than the first frequency.

A method, comprising:

• loading, based on a first frequency, a first logic value and a second logic value to a first interface circuit of a first die and a second interface circuit of a second die, respectively;
• capturing, during a first pulse with a second frequency, a third logic value presented by the second die;
• capturing, during a second pulse with the second frequency, a fourth logic value presented by the second die;
• and
• determining whether an interconnect coupling the first interface circuit to the second interface circuit has malfunction based on the fourth logic value;
• wherein the second frequency is substantially higher than the first frequency.