Force sensor architectures
AssigneeInfineon Technologies AG
InventorsUdo Ausserlechner, Manuel Gillinger
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AssigneeInfineon Technologies AG
InventorsUdo Ausserlechner, Manuel Gillinger
Estimating the term…
The described techniques are directed to a force sensor package that includes a force sensor and a temperature sensor combined in a monolithic integrated circuit. The force sensor package may also include other components, such as a memory and onboard processing circuitry (e.g. a microcontroller), which allows for temperature compensation to be performed on the force measurement signals generated by the force sensor. Force sensors are also described that include an integrated deformation body, such as a planar spring. Various types of deformation bodies are described, to which a force sensor chip is coupled. The structure and coupling between the force sensor chip and the deformation body facilitates the generation of stresses in two orthogonal directions in the force sensor chip having different values in response to an applied force.
A sensor package configured to be coupled to an object that is subjected to mechanical deformation, the sensor package comprising:
A sensor package, comprising:
A sensor package, comprising:
Dependencies are inferred from the claim text.