Compositions and methods for polishing substrates
AssigneeEntegris, Inc.
InventorsAaron Walsh, Aditya Dilip Verma, Sunny De
Life of this patent
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Abstract
Compositions for polishing substrates are provided. A composition comprises at least one of a plurality of coated particles, an oxidizer, a pH adjuster, or any combination thereof. The plurality of coated particles, the oxidizer, and the pH adjuster are present in an amount sufficient for the composition, when used for polishing a silicon carbide substrate, to reduce a surface roughness, Ra, of the silicon carbide substrate to 0.1 nm or less; and/or remove silicon carbide from the silicon carbide substrate at a material removal rate of 0.01 μm/hr or greater. Related methods and related kits, among other things, are also provided.
Claims20
A composition comprising:
- a plurality of coated particles;
- an oxidizer;
- and
- a pH adjuster;
- wherein the plurality of coated particles, the oxidizer, and the pH adjuster are present in an amount sufficient for the composition, when used for polishing a silicon carbide substrate, to:
- A) reduce a surface roughness, Ra, of the silicon carbide substrate to 0.1 nm or less;
- and
- B) remove silicon carbide from the silicon carbide substrate at a material removal rate of 0.01 μm/hr or greater.
A method comprising:
- obtaining a composition,
- wherein the composition comprises:
- a plurality of coated particles;
- an oxidizer;
- and
- a pH adjuster;
- dispensing the composition onto a silicon carbide substrate;
- and
- polishing, with a pad, a surface of the silicon carbide substrate, with the composition located between the pad and the surface of the silicon carbide substrate, so as to:
- A) reduce a surface roughness, Ra, of the silicon carbide substrate to 0.1 nm or less;
- and
- B) remove silicon carbide from the silicon carbide substrate at a material removal rate of 0.01 μm/hr or greater.
A kit comprising:
- a polishing pad;
- and
- a composition,
- wherein the composition comprises:
- a plurality of coated particles;
- an oxidizer;
- and
- a pH adjuster;
- wherein, when the composition is dispensed onto a silicon carbide substrate and when the polishing pad is used to polish the silicon carbide substrate, the composition:
- ′A) reduces a surface roughness, Ra, of the silicon carbide substrate to 0.1 nm or less;
- and
- B) removes silicon carbide from the silicon carbide substrate at a material removal rate of 0.01 μm/hr or greater.
Dependencies are inferred from the claim text.