Mechanical locking sputtering target bonding method and target assemblies produced thereby
AssigneeHoneywell International Inc.
InventorsSuiqiong Li, Nishanth Selvaraj, Stephane Ferrasse, Wayne Meyer, Michael Goodwater
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Abstract
A method of forming a bond in a sputtering assembly includes forming first projections on a bonding surface of a sputtering target, forming second projections on a bonding surface of a backing plate, aligning the sputtering target and the backing plate so that the first projections fit within the second recesses and the second projections fit within the first recesses to form an assembly; and applying pressure to the assembly so that first projections form an interlock bond between the sputtering target and the backing plate, wherein the interlock bond is void-free.
Claims20
A method of forming a bond in a sputtering assembly, the method comprising:
- forming first projections on a bonding surface of a sputtering target, the first projections spaced from adjacent first projections by first recesses;
- forming second projections on a bonding surface of a backing plate, the second projections spaced from adjacent second projections by second recesses and the backing plate having a greater hardness than the sputtering target;
- aligning the sputtering target and the backing plate so that the first projections fit within the second recesses and the second projections fit within the first recesses to form an assembly;
- and
- applying pressure to the assembly to form an interlock bond between the sputtering target and the backing plate, wherein the interlock bond is void-free.
A sputtering target assembly comprising:
- a sputtering target including a sputtering surface, first projections extending from a surface opposite the sputtering surface and first recesses between the first projections;
- and
- a backing plate including a back surface, second projections extending from a surface opposite the back surface, and second recesses between the second projections, wherein the first projections and the second projections form a void-free interlock bond.
Dependencies are inferred from the claim text.