Microelectronics device package with isolation and ceramic interposer forming thermal pad

An apparatus, comprising:

• a package substrate having a device side surface and having an opposite side surface, the package substrate comprising a first set of leads spaced from a first die pad configured for mounting semiconductor devices, and having a second set of leads spaced from a second die pad configured for mounting additional semiconductor devices, the first die pad and the first set of leads spaced from the second die pad and the second set of leads, the space between the first die pad and the second die pad forming an electrical isolation barrier;
• semiconductor devices mounted to the device side surface of the first die pad and at least one semiconductor device mounted to the device side surface of the second die pad;
• electrical connections formed between bond pads of the semiconductor devices mounted to the first die pad and the first set of leads, and formed between bond pads of the at least one semiconductor device mounted to the second die pad and the second set of leads;
• a ceramic interposer mounted to the opposite side surface of the package substrate and in thermal contact with at least the first die pad;
• and
• mold compound covering the semiconductor devices mounted to the first die pad, the at least one semiconductor device mounted to the second die pad, the electrical connections, a portion of the ceramic interposer, portions of the first set of leads, and portions of the second set of leads, the mold compound forming a body of a microelectronic device package, the ceramic interposer having a surface exposed from the mold compound, the first set of leads and the second set of leads having portions exposed from the body of the microelectronic device package to form terminals.

A microelectronic device package, comprising:

• a package substrate having a first set of leads spaced from a first die pad that is configured for mounting semiconductor devices, and having a second set of leads spaced from a second die pad configured for mounting additional semiconductor devices, the first die pad and the first set of leads spaced from the second die pad and the second set of leads, the space between the first die pad and the second die pad configured to form an electrical isolation barrier;
• semiconductor devices mounted to a device side surface of the first die pad and at least one semiconductor device mounted to a device side surface of the second die pad;
• wire bond connections formed between bond pads of the semiconductor devices mounted to the first die pad and the first set of leads, and additional wire bond connections formed between bond pads of the at least one semiconductor device mounted to the second die pad and the second set of leads;
• a ceramic interposer mounted to an opposite side surface of the package substrate opposite the device side surfaces of the first die pad and the second die pad, and in thermal contact with the first die pad and the second die pad;
• and
• mold compound covering the semiconductor devices mounted to the first die pad, the at least one semiconductor device mounted to the second die pad, the electrical connections, a portion of the ceramic interposer, portions of the first set of leads, and portions of the second set of leads, the mold compound forming a body of a microelectronic device package, the ceramic interposer having a surface exposed from the mold compound, the first set of leads and the second set of leads having portions exposed from the body of the microelectronic device package to form terminals.