Microelectronic device package with integrated passive component die and semiconductor device die

A microelectronic device package, comprising:

• a semiconductor trench capacitor die mounted to a device side surface of a semiconductor device die using conductive post connects extending from bond pads on the semiconductor device die and including solder on a distal end, the mounted semiconductor trench capacitor die extending away from the device side surface of the semiconductor device die;
• the semiconductor device die and the semiconductor trench capacitor die flip chip mounted to a device mounting surface of a package substrate, the package substrate including a cavity extending into the package substrate from the device mounting surface, the cavity in a position corresponding to the semiconductor trench capacitor die that extends into the cavity of the package substrate, and the package substrate including terminals on a board side surface;
• and
• mold compound covering the semiconductor device die, the semiconductor trench capacitor die and the device mounting surface of the package substrate, the mold compound filling space in the cavity around the trench capacitor semiconductor die, the mold compound forming the body of the microelectronic device package, the terminals of the package substrate forming terminals of the microelectronic device package.

A method comprising:

• forming a cavity in a device mounting surface of a package substrate, the package substrate including a board side surface opposite the device side surface;
• mounting a passive component die to a device side surface of a semiconductor device die using conductive post connects that extend from bond pads on device side surface of the semiconductor device die and that include solder at a distal end;
• subsequently flip chip mounting the semiconductor device die to the device mounting surface of the package substrate using additional conductive post connects that extend from bond pads on the device side surface of the semiconductor device die and which include solder on a distal end, the package substrate having terminals on a board side surface opposite the device mounting surface, the passive component die extending into the cavity from the device mounting surface of the package substrate, the passive component die spaced from sides and a bottom surface of the cavity;
• and
• covering the semiconductor device die, the passive component die, and the device mounting surface of the package substrate with mold compound, the mold compound forming the body of a microelectronic device package.