Semiconductor package

A semiconductor package comprising:

• a package substrate;
• a chip stack including a plurality of first semiconductor chips stacked on the package substrate;
• a first molding film disposed on the package substrate and encapsulating the chip stack;
• a second semiconductor chip disposed on the first molding film;
• a second molding film disposed on the first molding film and encapsulating the second semiconductor chip;
• a first connection wire vertically penetrating the first molding film, and electrically connected to the second semiconductor chip;
• a plurality of external terminals connected to a lower surface of the package substrate,
• wherein the chip stack is spaced apart from the first connection wire in a horizontal direction parallel to an upper surface, opposite to the lower surface, of the package substrate, and
• wherein each first semiconductor chip of the plurality of first semiconductor chips has an upper surface and a chip pad disposed at the upper surface of each first semiconductor chip;
• and
• a plurality of second connection wires connecting the plurality of chip pads of the plurality of the first semiconductor chips with each other.

A semiconductor package comprising:

• a package substrate;
• a chip stack having a plurality of first semiconductor chips stacked on an upper surface of the package substrate, and a plurality of first connection wires connecting the plurality of first semiconductor chips;
• a second connection wire disposed on the upper surface of the package substrate, spaced apart from the chip stack in a horizontal direction parallel to the upper surface of the package substrate, and connected to a substrate pad of the package substrate;
• a first molding film disposed on the upper surface of the package substrate and encapsulating the chip stack and the second connection wire;
• a second semiconductor chip disposed on the first molding film, and connected to an upper end of the second connection wire by using a solder member;
• and
• a second molding film disposed on the first molding film and encapsulating the second semiconductor chip.