Modular power overlay device and method

A method of configuring a modular POL device, comprising:

• selecting a set of first modular POL components having a first configuration comprising:
• a first dielectric layer having a first side and an opposing second side;
• a first conductive layer disposed on the first dielectric layer first side;
• a set of first semiconductor switching devices each having a respective source terminal, drain terminal, and gate terminal, the set of first semiconductor switching devices disposed on the first dielectric layer second side and arranged to cooperatively define a first half-bridge converter circuit, the first conductive layer electrically coupled to each respective source terminal through the first dielectric layer;
• a first electrically conductive substrate having a first side facing the set of first semiconductor switching devices, electrically coupled to each respective gate terminal of the set of first semiconductor switching devices, and an opposing second side;
• a first DC input terminal electrically coupled to a respective source terminal of a first one of the first semiconductor switching devices;
• a second DC input terminal electrically coupled to a respective drain terminal of a second one of the first semiconductor switching devices;
• and
• a first AC output terminal electrically coupled to a respective drain terminal of the first one of the first semiconductor switching device, and a source terminal of the second one of the first semiconductor switching devices;
• electrically coupling the respective first DC input terminals of the set of first modular POL components together to define a first DC input node, and electrically coupling the respective second DC input terminals of the set of first modular POL components together to define a second DC input node;
• and
• mounting the set of first modular POL components onto an electrically insulative common baseplate.