Semiconductor package

A semiconductor package comprising:

• a first wiring structure comprising a first wiring and a first wiring insulating layer surrounding the first wiring;
• a first semiconductor chip on the first wiring structure;
• a conductive pillar on the first wiring structure and extending in a vertical direction, the conductive pillar being spaced apart from the first semiconductor chip in a horizontal direction;
• a molding member on the first semiconductor chip and the conductive pillar;
• a second wiring structure on the molding member and comprising a second wiring and a second wiring insulating layer on the second wiring;
• and
• a second semiconductor chip on the second wiring structure,
• wherein the first wiring comprises a first wiring via and a first wiring line,
• wherein the first wiring structure comprises a first layer and a second layer,
• wherein the first wiring via is in each of the first layer and the second layer,
• wherein the first wiring via in the first layer and the first wiring via in the second layer contact each other in the vertical direction,
• wherein a size of the first wiring via in the first layer is different from a size of the first wiring via in the second layer,
• wherein the second wiring comprises a second wiring via and a second wiring line,
• wherein the second wiring structure comprises a first layer and a second layer,
• wherein the second wiring via is in each of the first layer and the second layer,
• wherein the second wiring via in the first layer and the second wiring via in the second layer contact each other in the vertical direction, and
• wherein a size of the second wiring via in the first layer is smaller than a size of the second wiring via in the second layer.

A semiconductor package comprising:

• a first wiring structure comprising a first wiring and a first wiring insulating layer surrounding the first wiring,
• a first semiconductor chip on the first wiring structure,
• a conductive pillar on the first wiring structure and extending in a vertical direction, the conductive pillar being spaced apart from the first semiconductor chip in a horizontal direction,
• a molding member on the first semiconductor chip and the conductive pillar,
• a second wiring structure on the molding member and comprising a second wiring and a second wiring insulating layer on the second wiring;
• and
• a second semiconductor chip on the second wiring structure,
• wherein the first wiring comprises a first wiring via and a first wiring line,
• wherein the first wiring structure comprises a first layer, a second layer, and a third layer,
• wherein the first wiring via is in each of the first layer, the second layer, and the third layer,
• wherein the first wiring via in the first layer, the first wiring via in the second layer, and the first wiring via in the third layer contact each other in the vertical direction,
• wherein a size of the first wiring via in the first layer is different from a size of the first wiring via in the second layer, and a size of the first wiring via in the second layer is different from a size of the third wiring via in the third layer,
• wherein the second wiring comprises a second wiring via and a second wiring line,
• wherein the second wiring structure comprises a first layer, a second layer, and a third layer,
• wherein the second wiring via is in each of the first layer, the second layer, and the third layer,
• wherein the second wiring via in the first layer, the second wiring via in the second layer, and the second wiring via in the third layer contact each other in the vertical direction,
• wherein a size of the second wiring via in the first layer is smaller than a size of the second wiring via in the second layer, and a size of the second wiring via in the second layer is smaller than a size of the third wiring via in the third layer, and
• wherein each of the first wiring via and the second wiring via comprises a dimple recessed downward in the vertical direction from a top surface of each of the first wiring via and the second wiring via.