Semiconductor package and method of fabricating the same

A semiconductor package comprising:

• a first redistribution substrate comprising a plurality of upper substrate pads;
• a first semiconductor device mounted on the first redistribution substrate and electrically connected to the first redistribution substrate through a first connection terminal disposed on the first redistribution substrate;
• a conductive through post disposed on the first redistribution substrate to be adjacent to the first semiconductor device;
• a sealant that seals the first semiconductor device and the conductive through post on the first redistribution substrate;
• a second redistribution substrate disposed on the first semiconductor device, the conductive through post, and the sealant;
• and
• a second semiconductor device mounted on the second redistribution substrate,
• wherein the plurality of upper substrate pads comprise a first upper substrate pad bonded to the first connection terminal and a second upper substrate pad bonded to the conductive through post, and
• the first upper substrate pad has a convex upper surface and has a coupling roughness formed on an upper surface thereof.

A semiconductor package comprising:

• a first redistribution substrate comprising a plurality of upper substrate pads including a first upper substrate pad;
• a first semiconductor device mounted on the first redistribution substrate and connected to the first redistribution substrate through bonding of the first upper substrate pad to a first connection terminal;
• a conductive through post disposed on the first redistribution substrate outside of the first semiconductor device as viewed from a plan view;
• a second redistribution substrate disposed on the first semiconductor device and the conductive through post;
• and
• a second semiconductor device mounted on the second redistribution substrate,
• wherein the first redistribution substrate comprises a substrate body, multilayer redistribution lines within the substrate body, and the plurality of upper substrate pads, and
• wherein the first upper substrate pad is connected to an uppermost redistribution line among the multilayer redistribution lines, has a convex upper surface, and has a coupling roughness formed on an upper surface thereof.