US 2026/0040973 A1 · PACKAGE SUBSTRATE WITH CORE HAVING METALLIZATION LAYERS TO FACILITATE SIGNAL ROUTING WITHIN THE CORE, AND RELATED FABRICATION METHODS AND INTEGRATED CIRCUIT (IC) PACKAGES

Abstract

Package substrate with a core having metallization layers to facilitate signal routing within the core, and related fabrication methods and integrated circuit (IC) packages. The core includes multiple core metallization layers that can be formed separately and coupled to each other to provide signal routing within the core. Metal interconnects in the multiple core metallization layers are coupled to each other through coupling of the core metallization layers to each other in the core to provide signal routing paths through the core. Including separate core metallization layers in the core provides flexibility in patterning location of the metal interconnects therein for routing flexibility within the core. This is opposed to only including singular body, vertical interconnects extending through the entire height of the core. Metal interconnects can also be patterned to extend laterally within a respective core metallization layer to provide lateral signal routing paths within a core metallization layer.

Claims23

Dependent claims

A substrate, comprising:

a first metallization layer extending in a first direction;
a second metallization layer extending in the first direction;
and
a core between the first metallization layer and the second metallization layer in a second direction orthogonal to the first direction,
the core, comprising:
a first core metallization layer, comprising:
a first core insulating layer;
and
a plurality of first metal interconnects;
and
a second core metallization layer adjacent to the first core metallization layer in the second direction, the second core metallization layer comprising:
a second core insulating layer;
and
a plurality of second metal interconnects,
a first one or more first metal interconnects of the plurality of first metal interconnects in the first core metallization layer each coupled to a second metal interconnect of the plurality of second metal interconnects in the second core metallization layer.

12 more elements

A method of fabricating a substrate for an integrated circuit (IC) package, comprising:

forming a core, comprising:
forming a first core metallization layer extending in a first direction, comprising:
forming a first core insulating layer;
and
forming a plurality of first metal interconnects;
and
forming a second core metallization layer extending in the first direction, comprising:
forming a second core insulating layer;
and
forming a plurality of second metal interconnects;
and
coupling the second core metallization layer to the first core metallization layer in a second direction orthogonal to the first direction coupling each of a first one or more first metal interconnects of the plurality of first metal interconnects in the first core metallization layer to a second metal interconnect of the plurality of second metal interconnects in the second core metallization layer;
forming a first metallization layer adjacent to the first core metallization layer in the second direction;
and
forming a second metallization layer adjacent to the second core metallization layer in the second direction.

12 more elements

Dependencies are inferred from the claim text.

Package substrate with core having metallization layers to facilitate signal routing within the core, and related fabrication methods and integrated circuit (ic) packages

Life of this patent

Package substrate with core having metallization layers to facilitate signal routing within the core, and related fabrication methods and integrated circuit (ic) packages

Life of this patent

Abstract

Claims23