Package structure and package method

Abstract

A package structure includes a substrate having conductive lines along a direction parallel to a surface of the substrate, and an optoelectronic chip bonded on the first substrate. A part of areas of the substrate is a first substrate, and remaining areas of the substrate are a second substrate. A base material of the first substrate is a light-transparent material, the first substrate has the conductive lines, and a base material of the second substrate is a non-light-transparent material. An active area of the optoelectronic chip is oriented toward the first substrate. The active area is arranged staggered with the conductive lines in the first substrate, and the optoelectronic chip is electrically connected with the conductive lines in the first substrate.

Dependencies are inferred from the claim text.