Delamination mitigation for an integrated circuit
AssigneeTexas Instruments Incorporated
InventorsGuangxu Li, Sylvester Ankamah-Kusi, Blake Travis, Rajen Manicon Murugan, Yutaka Suzuki
Life of this patent
Estimating the term…
Abstract
An electronic device includes a leadframe, where the leadframe includes inner leads, external leads, and die attach portions. The leadframe has channels defined at a junction between the die attach portions and the inner leads, where the channel mitigates crack propagation along a path of the die attach portions. A die assembly is attached to the die attach portions and copper pillars are provided to connect the die assembly to the die attach portions. A mold compound encapsulates the die assembly, the inner leads, the die attach portions, and the copper pillars.
Claims21
An electronic device comprising:
- a leadframe, the leadframe including inner leads, external leads, die attach portions, and a crack mitigating feature;
- a die assembly attached to the die attach portions;
- interconnects connecting the die assembly to the die attach portions;
- and
- a mold compound encapsulating the die assembly, the inner leads, the die attach portions, and the interconnects.
An electronic device comprising:
- a leadframe, the leadframe including inner leads, external leads, and die attach portions, the leadframe having channels defined therein at a junction between the die attach portions and the inner leads, the channel mitigating crack propagation along a path of the die attach portions;
- a die assembly attached to the die attach portions;
- copper pillars connecting the die assembly to the die attach portions;
- and
- a mold compound encapsulating the die assembly, the inner leads, the die attach portions, and the copper pillars.
An electronic device comprising:
- a leadframe, the leadframe including inner leads, external leads, and die attach portions, the die attach portions being partially etched to form a crack propagation barrier at a junction between the die attach portions and the inner leads, the crack propagation barrier mitigating crack propagation along a path of the die attach portions;
- a die assembly attached to the die attach portions;
- copper pillars connecting the die assembly to the die attach portions;
- and
- a mold compound encapsulating the die assembly, the inner leads, the die attach portions, and the copper pillars.
A method comprising:
- etching a channel in a leadframe at a junction defined between die attach portions and inner leads of the leadframe, the channel mitigating crack propagation along a path defined along the die attach portions;
- attaching a die assembly to the die attach portions of the leadframe via interconnects;
- and
- forming a mold compound over the die assembly, the inner leads, the die attach portions, and the interconnects, the mold compound encapsulating the die assembly, the inner leads, the die attach portions, and the interconnects.
Dependencies are inferred from the claim text.