Chip on lead device and manufacturing method
OwnerAnindya Poddarinventor
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Abstract
An electronic device includes a non-conductive die attach film on a side of a conductive lead, a semiconductor die having a first side and a lateral side, the first side on the non-conductive die attach film, and the lateral side including striations, and a package structure enclosing the semiconductor die and a portion of the conductive lead. A method includes singulating portions of a non-conductive die attach film on a carrier, attaching a backside of a wafer to the singulated portions of the non-conductive die attach film, and singulating semiconductor dies of the wafer while the backside of the wafer is attached to the singulated portions of the non-conductive die attach film.
Claims22
An electronic device, comprising:
- a conductive lead;
- a non-conductive die attach film on a side of the conductive lead;
- a semiconductor die having a first side and a lateral side, the first side on the non-conductive die attach film, and the lateral side including striations;
- and
- a package structure enclosing the semiconductor die and a portion of the conductive lead.
A system, comprising:
- a circuit board with a conductive feature;
- and
- an electronic device, comprising:
- a conductive lead connected to the conductive feature of the circuit board;
- a non-conductive die attach film on a side of the conductive lead;
- a semiconductor die having a first side and a lateral side, the first side on the non-conductive die attach film, and the lateral side including striations;
- and
- a package structure enclosing the semiconductor die and a portion of the conductive lead.
A method of fabricating an electronic device, the method comprising:
- singulating portions of a non-conductive die attach film on a carrier;
- attaching a backside of a wafer to the singulated portions of the non-conductive die attach film;
- and
- singulating semiconductor dies of the wafer while the backside of the wafer is attached to the singulated portions of the non-conductive die attach film.
Dependencies are inferred from the claim text.