Integrated circuit and package with improved fault protection
AssigneeMonolithic Power Systems, Inc.
InventorsZheng Luo, Yiming Li, Hunt Hang Jiang
Life of this patent
Estimating the term…
Abstract
An integrated circuit (“IC”) chip having fault protection features. The IC chip in an embodiment may include a lead frame having a first portion adapted to accommodate an IC bare die and a second portion separated from first portion and adapted to be configured as an electrically conductive lead pad. The electrically conductive connector includes a lead fuse section having a reduced size in comparison with a remainder of the second portion.
Claims38
An integrated circuit (“IC”) chip, comprising:
- a lead frame including a first portion and a second portion laterally separated from each other;
- an IC bare die mounted on the first portion of the lead frame with a die bottom surface of the IC bare die attached to the first portion and a die top surface of the IC bare die having a first contact pad formed, the die top surface being opposite to the die bottom surface, wherein the first contact pad is coupled to the second portion of the lead frame;
- and wherein
- the second portion of the lead frame includes a lead fuse section having a reduced size in comparison with a remainder of the second portion.
A lead frame adapted to be used in a package for an integrated circuit (“IC”), comprising:
- a first portion adapted to receive an IC bare die;
- a second portion separated from the first portion and adapted to be configured as an electrically conductive lead pad, wherein the second portion includes a lead fuse section having a reduced size in comparison with a remainder of the second portion.
An integrated circuit (“IC”) chip, comprising:
- an input pin adapted to be configured to receive an input power supply voltage;
- an output pin adapted to be coupled to a load;
- a power switch coupled between the input pin and the output pin;
- a fuse-like protection pin adapted to be configured to support a fuse-like protection mode when a capacitive element is coupled to the fuse-like protection pin, and wherein the IC chip is configured to enter the fuse-like protection mode once a fuse-like protection threshold is triggered;
- and
- a package level fuse protection structure integrated and couped in series with the output pin.
Dependencies are inferred from the claim text.