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US 2026/0040943 A1Published application
Optical engine device and semiconductor package including the same
AssigneeSamsung Electronics Co., Ltd.
InventorsJing Cheng LIN, Jung Hua CHANG
Life of this patent
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Abstract
An optical engine device includes an electronic integrated circuit (EIC) chip, and a photonic chip on the EIC chip, where the PIC chip includes a first photonic chip sidewall, a photonic chip substrate having an inclined upper surface, and a reflective pattern on the inclined upper surface of the photonic chip substrate, and where at least a portion of the reflective pattern is horizontally spaced apart from the first photonic chip sidewall.
Claims20
An optical engine device comprising:
- an electronic integrated circuit (EIC) chip;
- and
- a photonic chip on the EIC chip,
- wherein the photonic chip comprises:
- a first photonic chip sidewall;
- a photonic chip substrate having an inclined upper surface;
- and
- a reflective pattern on the inclined upper surface of the photonic chip substrate, and
- wherein at least a portion of the reflective pattern is horizontally spaced apart from the first photonic chip sidewall.
6 more elements
A semiconductor package comprising:
- an interposer substrate;
- a semiconductor chip on an upper surface of the interposer substrate;
- a memory device on the upper surface of the interposer substrate and horizontally spaced apart from the semiconductor chip;
- and
- an optical engine device on the upper surface of the interposer substrate,
- wherein the optical engine device comprises:
- an electronic integrated circuit (EIC) chip comprising a through via;
- a photonic chip on the EIC chip, the photonic chip comprising a first photonic chip sidewall;
- and
- a fiber optic device on the first photonic chip sidewall,
- wherein the photonic chip further comprises a reflective pattern horizontally spaced apart from at least a portion of the fiber optic device, and
- wherein the first photonic chip sidewall is vertically aligned with a first EIC sidewall of the EIC chip and a first interposer sidewall of the interposer substrate.
9 more elements
An optical engine device comprising:
- a redistribution substrate comprising a lower insulating layer and a redistribution pattern;
- conductive bumps on a lower surface of the redistribution substrate;
- an electronic integrated circuit (EIC) chip on an upper surface of the redistribution substrate;
- and
- a photonic chip on the EIC chip,
- wherein the EIC chip comprises:
- an EIC substrate;
- a through via in the EIC substrate;
- a lower wiring layer on a lower surface of the EIC substrate, the lower wiring layer comprising a lower insulating layer and a lower conductive wire;
- and
- an upper wiring layer on an upper surface of the EIC substrate, the upper wiring layer comprising an upper insulating layer and an upper conductive wire, and
- wherein the photonic chip comprises:
- a first photonic chip sidewall;
- a photonic chip substrate having an inclined upper surface;
- insulating layers on a lower surface of the photonic chip substrate;
- a bonding coupler between the insulating layers;
- a metal block pattern vertically spaced apart from a lower surface of the bonding coupler;
- and
- a reflective pattern on the inclined upper surface of the photonic chip substrate and horizontally spaced apart from the first photonic chip sidewall.
16 more elements
Dependencies are inferred from the claim text.