Semiconductor Device and Method of Making a Fan-Out Quilt Package
AssigneeSTATS ChipPAC Pte. Ltd.
InventorsDanFeng Yang, Kai Chong Chan, Swain Hong Alfred Yeo, Linda Pei Ee Chua
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Abstract
A semiconductor device has a substrate formed on a first carrier. A semiconductor die is mounted on the substrate. An interconnect structure is formed on a second carrier. A copper pillar is formed on the substrate or interconnect structure. The interconnect structure is disposed over the substrate with the copper pillar and semiconductor die between the substrate and interconnect structure. The first carrier and second carrier are removed after disposing the interconnect structure over the substrate. A system-in-package (SiP) is mounted to the substrate opposite the semiconductor die after removing the first carrier.
Claims25
A method of making a semiconductor device, comprising:
- forming a substrate on a first carrier;
- mounting a semiconductor die on the substrate;
- forming an interconnect structure on a second carrier;
- forming a copper pillar on the substrate or interconnect structure;
- disposing the interconnect structure over the substrate with the copper pillar and semiconductor die disposed between the substrate and interconnect structure;
- removing the first carrier and second carrier after disposing the interconnect structure over the substrate;
- and
- mounting a system-in-package (SiP) to the substrate opposite the semiconductor die after removing the first carrier.
A method of making a semiconductor device, comprising:
- forming a substrate;
- mounting a semiconductor die on the substrate;
- forming an interconnect structure;
- forming a copper pillar on the substrate or interconnect structure;
- disposing the interconnect structure over the substrate with the copper pillar and semiconductor die disposed between the substrate and interconnect structure;
- and
- mounting a system-in-package (SiP) to the substrate opposite the semiconductor die.
A method of making a semiconductor device, comprising:
- forming a substrate;
- mounting a semiconductor die on the substrate;
- forming an interconnect structure;
- disposing the interconnect structure over the substrate with the semiconductor die disposed between the substrate and interconnect structure;
- and
- mounting a system-in-package (SiP) to the substrate opposite the semiconductor die.
A semiconductor device, comprising:
- a substrate;
- a semiconductor die mounted on the substrate;
- an interconnect structure disposed over the substrate with the semiconductor die between the substrate and interconnect structure;
- and
- a system-in-package (SiP) mounted to the substrate opposite the semiconductor die.
Dependencies are inferred from the claim text.