Fabric Die to Fabric Die Interconnect for Modularized Integrated Circuit Devices

A die comprising:

• a shoreline;
• and
• a plurality of rows, wherein a row of the plurality of rows comprises:
• a set of compute blocks separate from the shoreline of the die;
• and
• an inter-die interconnect interface coupled via a set of microbumps to the set of compute blocks, wherein the inter-die interconnect interface is configured to communicatively couple the die to a second die.

A data processing system comprising:

• a network interface;
• a memory;
• processing circuitry coupled to the network interface and the memory;
• a first die comprising a first row of compute blocks comprising a first plurality of interconnect interfaces configured to electrically couple to a first plurality of electrical connections disposed on a side of the first die;
• a second die comprising a second row of compute blocks comprising a second plurality of interconnect interfaces configured to electrically couple to a second plurality of electrical connections disposed on a side of the second die;
• and
• a silicon interposer configured to electrically couple to the first plurality of electrical connections and the second plurality of electrical connections.