Semiconductor device and method of manufacturing the same
AssigneeSamsung Electronics Co., Ltd.
InventorsSeran OH, Myungho KONG, Sukhoon KIM, Yeonuk KIM, Joenggi YUN, Dosun LEE
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Abstract
A semiconductor device includes a first structure including a first insulating layer and a first conductive wiring arranged on the first insulating layer, a second-1 insulating layer arranged above the first structure in a first direction, a via hole penetrating the second-1 insulating layer in the first direction, a barrier layer arranged at a lower side of the via hole, and a via plug electrically connected to the first conductive wiring and arranged to fill a remaining space in an internal space of the via hole, excluding the barrier layer.
Claims20
A semiconductor device comprising:
- a first structure including a first insulating layer and a first conductive wiring arranged on the first insulating layer;
- a second-1 insulating layer arranged above the first structure in a first direction;
- a via hole penetrating the second-1 insulating layer in the first direction;
- a barrier layer arranged at a lower side of the via hole;
- and
- a via plug electrically connected to the first conductive wiring and arranged to fill a remaining space in an internal space of the via hole, excluding the barrier layer.
A method of manufacturing a semiconductor device comprising a first structure including a first insulating layer and a first conductive wiring arranged on the first insulating layer;
- and a second structure including a second insulating layer and a second conductive wiring arranged on the second insulating layer, the method comprising:
- forming, above the first structure in a first direction, a second-1 insulating layer that forms a lower portion of the second insulating layer;
- forming a via hole penetrating the second-1 insulating layer in the first direction;
- forming a barrier layer arranged at a lower side of an internal space of the via hole;
- etching a portion of the barrier layer arranged at an upper side within the internal space of the via hole;
- and
- forming a via plug electrically connected to the first conductive wiring by depositing a conductive material in a remaining space in the internal space of the via hole, excluding the barrier layer.
Dependencies are inferred from the claim text.