Semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorsHyeonjeong HWANG, Junghoon KANG, Hyunsoo CHUNG
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Abstract
Provided is a semiconductor package including a first semiconductor chip, a plurality of second semiconductor chips stacked on the first semiconductor chip, a step cover layer surrounding side surfaces of the plurality of second semiconductor chips and covering side portions of the plurality of second semiconductor chips, wherein a maximum thickness of the step cover layer is 40 micrometers (μm) or less, and a moisture barrier layer covering an outer surface of the step cover layer.
Claims20
A semiconductor package, comprising:
- a first semiconductor chip;
- a plurality of second semiconductor chips stacked on the first semiconductor chip;
- a step cover layer surrounding side surfaces of the plurality of second semiconductor chips and covering side portions of the plurality of second semiconductor chips, wherein a maximum thickness of the step cover layer is 40 micrometers (μm) or less;
- and
- a moisture barrier layer covering an outer surface of the step cover layer.
A semiconductor package, comprising:
- a first semiconductor chip;
- a second semiconductor chip disposed on the first semiconductor chip;
- a step cover layer surrounding side surfaces of the first semiconductor chip and the second semiconductor chip, and covering side portions of the first semiconductor chip and the second semiconductor chip, wherein a maximum thickness of the step cover layer is 40 micrometers (μm) or less;
- and
- a moisture barrier layer covering an outer surface of the step cover layer.
A semiconductor package, comprising:
- a first semiconductor chip;
- a plurality of second semiconductor chips stacked on the first semiconductor chip;
- a dummy chip disposed on the plurality of second semiconductor chips;
- a step cover layer including an organic material, wherein the step cover layer surrounds side surfaces of the plurality of second semiconductor chips and a side surface or upper surface of the dummy chip, and covers side portions of the plurality of second semiconductor chips;
- a moisture barrier layer including an inorganic material, wherein the moisture barrier layer covers an outer surface of the step cover layer;
- and
- a molding member including a second organic material, wherein the molding member covers an outer surface of the moisture barrier layer, wherein
- the step cover layer covers the side surfaces of the plurality of second semiconductor chips and a stepped surface exposed by a side step between the plurality of second semiconductor chips.
Dependencies are inferred from the claim text.