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US 2026/0040901 A1Published application
Interconnect defect monitor system with electrostatic discharge circuit and method for testing
AssigneeAvago Technologies International Sales Pte. Limited
InventorsSam Ziqun Zhao, Xiaoming Li, Liming Tsau, Teck Yang Tan, Reza Sharifi
Life of this patent
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Abstract
An electronic product includes a package substrate, a number of die, and an interposer. The die are coupled to the interposer, and each respective includes an edge integrity detection structure extending along at least part of an edge of the respective die. The package substrate includes at least one pad coupled to at least one edge integrity detection structure of at least one die of the die.
Claims20
An electronic product, comprising:
- a die;
- and
- an interposer, wherein the die is coupled to the interposer, wherein the die comprises an interconnect integrity detection structure comprising a plurality of terminals in at least one corner of the die, wherein the interposer comprises at least two pads coupled to the interconnect integrity detection structure of the die.
A multichip device, comprising
- a plurality of integrated circuit (IC) die, wherein each respective die comprises an interconnect integrity detection structure;
- and
- an interposer wherein the plurality of IC die are disposed on a top surface of the interposer, wherein at least one pad is coupled to at least one interconnect integrity detection structure of at least one die of the die, wherein the at least interconnect integrity detection structure is coupled to an electrostatic discharge circuit on the die.
A multichip device, comprising:
- an interposer;
- and
- a number of integrated circuit (IC) die, wherein each respective IC die includes an interconnect integrity detection structure, wherein each IC die is disposed on a top surface of the interposer, and at least two terminals of the interconnect integrity detection structure are coupled to at least two pads of the interconnect integrity detection structure of the interposer.
Dependencies are inferred from the claim text.