US 2026/0040889 A1Published application

Wafer positioning ring device

AssigneePasco Precision Corp.

InventorChih-Ching LIN

Life of this patent

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Abstract

A wafer positioning ring device includes a polishing ring that has a polishing ring inner surface surrounded by a polishing ring outer surface, a connecting ring that has a connecting ring inner surface surrounded by a connecting ring outer surface, and a positioning unit. The positioning unit includes first positioning members that are disposed on one of the polishing ring outer surface of the polishing ring and the connecting ring inner surface of the connecting ring, and second positioning members that are disposed on another one of the polishing ring outer surface of the polishing ring and the connecting ring inner surface of the connecting ring. The second positioning members and the first positioning members are detachably and respectively connected to each other such that the connecting ring is positioned to the polishing ring.

Claims13

Dependent claims

A wafer positioning ring device comprising:

a polishing ring having a polishing ring inner surface and a polishing ring outer surface that surrounds said polishing ring inner surface;
a connecting ring having a connecting ring inner surface and a connecting ring outer surface that surrounds said connecting ring inner surface;
and
a positioning unit including
a plurality of first positioning members that are spaced apart from each other and that are disposed on one of said polishing ring outer surface of said polishing ring and said connecting ring inner surface of said connecting ring, and
a plurality of second positioning members that are spaced apart from each other and that are disposed on another one of said polishing ring outer surface of said polishing ring and said connecting ring inner surface of said connecting ring;
wherein said plurality of second positioning members and said plurality of first positioning members are detachably and respectively connected to each other such that said connecting ring is positioned on top of said polishing ring.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 19/212,282Filed 19 May 2025
Priority: TW 1131288141 Aug 2024
Published: 5 Feb 2026
Term ends: Not estimatedThe source records don’t support an estimate.

Classification8 codes

H10P 72/7606
The wafers being placed on a susceptor, stage or support: characterised by edge clamping, e.g. clamping ring
B24B 37/32
For single side lapping of plane surfaces: retaining rings
H10P 72/0428
Apparatus for manufacture or treatment: apparatus for mechanical treatment or grinding or cutting
H10P 72/50
Handling or holding of wafers, substrates or devices during manufacture or treatment thereof: for positioning, orientation or alignment