Bonded body and method for producing bonded body

Abstract

A bonded body has a piezoelectric material substrate 11, a support substrate 13 bonded to the piezoelectric material substrate, and an outer peripheral processed part in which outer peripheral parts of the piezoelectric material substrate 11 and the support substrate 13 are inclined with respect to a main surface of the piezoelectric material substrate 11. The outer peripheral processed part includes a first inclined surface that is a surface that the piezoelectric material substrate 11 faces, and a second inclined surface that is on a plane extending from the first inclined surface toward the outer peripheral part and that is a surface that the support substrate 13 faces. Consequently, a bonded body in which no corners are formed on the outer peripheral part and fracture and cracks are less likely to occur in the outer peripheral part in subsequent steps, and a method for producing a bonded body are provided.

Dependencies are inferred from the claim text.