Electronic device and manufacturing method thereof

Abstract

A manufacturing method of an electronic device includes following steps: (a) providing an electronic panel, wherein the electronic panel includes a first substrate and a plurality of electronic elements, and the plurality of electronic elements are bonded on the first substrate; (b) inspecting the electronic panel, wherein when the electronic panel is determined to be a defective product, perform following step (c) to step (f); (c) debonding the plurality of electronic elements from the first substrate; (d) transferring the plurality of electronic elements to a temporary substrate; (e) transferring the plurality of electronic elements from the temporary substrate to a second substrate; and (f) bonding the plurality of electronic elements on the second substrate.

Dependencies are inferred from the claim text.