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US 2026/0040734 A1Published application
Microdevice cartridge structure
AssigneeVueReal Inc.
InventorsGholamreza Chaji, Ehsanollah Fathi
Life of this patent
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Abstract
What is disclosed is structures and methods of integrating micro devices into system substrate. Further, the disclosure, also relates to methods and structures for enhancing the bonding process of micro-devices into a substrate. More specifically, it relates to expanding the micro device area or bonding area of micro devices.
Claims15
An optoelectronic device comprising:
- a plurality of semiconductor layers, disposed on a substrate, forming a top surface and a bottom surface, wherein the plurality of semiconductor layers have isolated areas forming at least one side surface;
- at least one conductive pad coupled to the top surface, the bottom surface, or both;
- and
- one or more extension layers formed around the at least one side surface, wherein the at least the one conductive pad is extended to the one or more extension layers.
1 more element
A microdevice structure comprising:
- a top doped layer;
- a bottom doped layer;
- an active layer between the top doped layer and the bottom doped layer;
- a VIA from the top doped layer to the bottom doped layer where the VIA is passivated with a dielectric and filled at least partially by a conductive material;
- and
- a dielectric layer separating the VIA from the top doped layer.
3 more elements
Dependencies are inferred from the claim text.