Integration of microdevices into system substrate
AssigneeVueReal Inc.
InventorsGholamreza Chaji, Ehsanollah Fathi
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Abstract
In a micro-device integration process, a donor substrate is provided on which to conduct the initial manufacturing and pixelation steps to define the micro devices, including functional, e.g. light emitting layers, sandwiched between top and bottom conductive layers. The microdevices are then transferred to a system substrate for finalizing and electronic control integration. The transfer may be facilitated by various means, including providing a continuous light emitting functional layer, breakable anchors on the donor substrates, temporary intermediate substrates enabling a thermal transfer technique, or temporary intermediate substrates with a breakable substrate bonding layer.
Claims18
A method of forming a cartridge from microdevices, the method comprising:
- preparing the microdevices on a donor substrate;
- forming and post-processing the microdevices;
- preparing the microdevices to be separated from the donor substrate;
- forming the cartridge from the microdevices;
- identifying defective microdevices;
- and
- removing a set of microdevices from the cartridge if a number of defects in the set of microdevices in the cartridge is more than a threshold value.
Dependencies are inferred from the claim text.