Substrate structure
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsPei-Geng Weng, Fang-Lin Tsai, Wei-Son Tsai, Yih-Jenn Jiang
Life of this patent
Estimating the term…
Abstract
A substrate structure is provided with a first electrical contact pad formed on an insulating layer of a substrate body, where the first electrical contact pad includes a first pad portion disposed on the insulating layer and at least one first protruding portion embedded in the insulating layer, so that the first pad portion is electrically connected to a circuit layer in the insulating layer by a conductive blind via, and the first protruding portion is free from being electrically connected to the circuit layer, such that, through a design of the first protruding portion, all surfaces of a metal layer formed on the insulating layer can meet the requirement of coplanarity.
Claims10
A substrate structure, comprising:
- a substrate body including at least one insulating layer, a plurality of circuit layers bonded to the at least one insulating layer, and a plurality of conductive blind vias formed in the at least one insulating layer and electrically connected to the plurality of circuit layers;
- at least one electrical contact pad formed on an outermost insulating layer, wherein the electrical contact pad includes a pad portion located on the outermost insulating layer and electrically connected to the circuit layer by the conductive blind via connected thereto;
- and
- a metal block formed on the outermost insulating layer, wherein the metal block is free from being electrically connected to the circuit layer,
- wherein a volume of the electrical contact pad and the conductive blind via connected thereto is equal to a volume of the metal block, and wherein an outermost surface of the electrical contact pad is substantially coplanar with an outermost surface of the metal block.
Dependencies are inferred from the claim text.