Bga antipad design for reduced cross talk

A method, comprising:

• providing, in a printed circuit board (PCB), a top metal layer including a plurality of ball grid array (BGA) pads to couple to a BGA device;
• providing, in the PCB, a first internal metal layer below the top metal layer, the first internal metal layer including a first breakout trace coupled to a first one of the BGA pads by a first via;
• providing, in the PCB, a second internal metal layer below the first internal metal layer, the second internal metal layer including a second breakout trace coupled to a second one of the BGA pads by a second via;
• and
• providing, in the PCB, a third internal metal layer below the second internal metal layer, the third internal metal layer including a third breakout trace coupled to a third one of the BGA pads by a third via;
• wherein:
• in the first internal metal layer, the third via is separated from the first breakout trace by a first antipad having a first dimension;
• and
• in the second internal metal layer, the third via is separated from the second breakout trace by a second antipad having a second dimension that is greater than the first dimension.

An information handling system, comprising:

• a ball grid array (BGA) device;
• and
• a printed circuit board including:
• a top metal layer including a plurality of BGA pads coupled to the BGA device;
• a first internal metal layer below the top metal layer, the first internal metal layer including a first breakout trace coupled to a first one of the BGA pads by a first via;
• a second internal metal layer below the first internal metal layer, the second internal metal layer including a second breakout trace coupled to a second one of the BGA pads by a second via;
• and
• a third internal metal layer below the second internal metal layer, the third internal metal layer including a third breakout trace coupled to a third one of the BGA pads by a third via;
• wherein:
• in the first internal metal layer, the third via is separated from the first breakout trace by a first antipad having a first dimension;
• and
• in the second internal metal layer, the third via is separated from the second breakout trace by a second antipad having a second dimension that is greater than the first dimension.