Semiconductor device packages with exposed heat dissipating surfaces and methods of fabricating the same
AssigneeWolfspeed, Inc.
InventorsAlexander Komposch, Eng Wah Woo, Soon Lee Liew, Kok Meng Kam
Life of this patent
Estimating the term…
Abstract
A semiconductor device package includes an interconnect structure with a first surface having at least one die thereon and a second surface that is opposite the first surface and is configured to be coupled to an external device. A protective structure on the first surface of the interconnect structure exposes a heat dissipating surface facing away from the interconnect structure in one or more directions. Related devices and fabrication methods are also discussed.
Claims20
A semiconductor device package, comprising:
- an interconnect structure comprising a substrate and conductive patterns therein and/or thereon, the interconnect structure comprising a first surface and a second surface that is opposite the first surface;
- a plurality of dies on the first surface of the interconnect structure and electrically connected to the conductive patterns by conductive bumps therebetween;
- and
- a thermally conductive member on the plurality of dies opposite the interconnect structure.
A semiconductor device package, comprising:
- an interconnect structure comprising a substrate and conductive patterns therein and/or thereon, the substrate comprising a first surface and a second surface that is opposite the first surface;
- and
- a plurality of dies on the first surface of the substrate and electrically connected to the conductive patterns by conductive bumps therebetween,
- wherein the plurality of dies comprise respective heat dissipating surfaces opposite the interconnect structure that provide one or more first heat conduction paths away from the plurality of dies in a first direction, and wherein the conductive bumps and the interconnection structure provide a second heat conduction path away from the plurality of dies in a second direction that is opposite the first direction.
A semiconductor device package, comprising:
- an interconnect structure comprising a substrate and conductive patterns therein and/or thereon, the substrate comprising a first surface and a second surface that is opposite the first surface;
- a plurality of dies on the first surface of the substrate and electrically connected to the conductive patterns by conductive bumps therebetween,
- wherein the plurality of dies comprise respective heat dissipating surfaces opposite the interconnect structure with respective heights that differ relative to the first surface of the interconnect structure.
Dependencies are inferred from the claim text.