Systems and methods for packaging semiconductor devices with scalable interconnects

A semiconductor device comprising:

• a first substrate comprising a first top surface and a first bottom surface, the first top surface comprising a first region, a second region and a third region, the third region being positioned between the first region and the second region, the first region comprising a first plurality of electrical contacts, the second region comprising a second plurality of electrical contacts, the third region comprising a third plurality of electrical contacts;
• an integrated circuit comprises a fourth plurality of electrical contacts, the fourth plurality of electrical contacts being electrically coupled to the third plurality of electrical contacts;
• a second substrate comprising a fourth region and a fifth region, the fourth region comprising a fifth plurality of electrical contacts electrically coupled to the first plurality of electrical contacts;
• a third substrate comprising a sixth region and a seventh region, the sixth region comprising a sixth plurality of electrical contacts electrically coupled to the second plurality of electrical contacts;
• and
• a stiffener ring comprising a ring comprising an eighth region and a ninth region, the eighth region comprising a thermally conductive material thermally coupled to the fourth region, the ninth region being coupled to the sixth third region.

The semiconductor device of claim of 15 wherein:

• the fourth region is positioned over the first region;
• the fifth region is positioned outside the first substrate;
• the fifth region comprises a seventh plurality of electrical contacts coupled to an electrical connector;
• the sixth region is positioned over the second region;
• the seventh region is positioned outside the first substrate;
• the stiffener ring comprises an opening exposing a portion of the third region;
• and
• the seventh region comprises an eighth plurality of electrical contacts coupled to an optical circuit.

A semiconductor device comprising:

• a first substrate comprising a first top surface a first bottom surface, the first top surface comprising a first region and a second region and a third region, the third region being positioned between the first region and the second region, the first region comprising a first plurality of electrical contacts, the second region comprising a second plurality of electrical contacts, the third region comprising a third plurality of electrical contacts;
• an integrated circuit comprises a fourth plurality of electrical contacts, the fourth plurality of electrical contacts being electrically coupled to the third plurality of electrical contacts;
• a second substrate comprising a second top region and second bottom region, the second substrate further comprising a fourth region and a fifth region, the fourth region comprising a fifth plurality of electrical contacts electrically coupled to the first plurality of electrical contacts;
• a third substrate comprising a sixth region and a seventh region, the sixth region comprising a sixth plurality of electrical contacts electrically coupled to the second plurality of electrical contacts;
• a stiffener ring comprising a thermally conductive material and coupled to the fourth region and the sixth region, the stiffener ring comprising an opening exposing a portion of the third region;
• and
• an optical circuit comprising an electrical interface and an optical interface, the electrical interface being coupled to the seventh plurality of electrical contacts.