Optical device and optical transmitting-receiving module
AssigneeFujitsu Optical Components Limited
InventorsTsuyoshi AOKI, Tamotsu AKASHI, Nobuaki HATORI, Masanari YAMAKITA, Yurika YANADA
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AssigneeFujitsu Optical Components Limited
InventorsTsuyoshi AOKI, Tamotsu AKASHI, Nobuaki HATORI, Masanari YAMAKITA, Yurika YANADA
Estimating the term…
An optical device includes a photonic integrated circuit chip and a resin member. The photonic integrated circuit chip has a first surface on which an optical circuit and first electrical wiring are formed. The resin member makes contact with at least part of the photonic integrated circuit chip. A dam structure is formed along an outer circumference of the first surface. At least part of the optical circuit is formed using a different material that is different from a material of the photonic integrated circuit chip. The resin member seals the photonic integrated circuit chip without sealing an area on an inner side with respect to the dam structure of the first surface. Second electrical wiring is formed on a surface of the resin member. The second electrical wiring is electrically connected to the first electrical wiring.
An optical device comprising:
An optical transmitting-receiving module comprising:
Dependencies are inferred from the claim text.