Edge coupling to surface coupling photonics device

A co-packaged device comprising:

• a package substrate;
• an integrated circuit device mounted to the package substrate;
• and
• a photonics device mounted to the package substrate and connected to the integrated circuit device, wherein the photonics device comprises:
• a device and dielectric layer comprising a first recess within a first surface of the device and dielectric layer and a second recess within the first surface of the device and dielectric layer;
• and
• a first coupling device mounted to the first surface of the device and dielectric layer, the first coupling device comprising a first mounting element and a first extended region, wherein the first mounting element is disposed within the first recess and the first extended region is disposed within the second recess, and wherein the first extended region is configured to reflect an optical signal through the device and dielectric layer.

A computer system comprising:

• computing devices;
• and
• a co-packaged device coupled to the computing devices and configured to communicate signals to and from the computing devices, the co-packaged device comprising:
• a package substrate;
• an integrated circuit device mounted to the package substrate;
• and
• a photonics device mounted to the package substrate and connected to the integrated circuit device, wherein the photonics device comprises:
• a device and dielectric layer comprising a first recess within a first surface of the device and dielectric layer and a second recess within the first surface of the device and dielectric layer;
• and
• a first coupling device mounted to the first surface of the device and dielectric layer, the first coupling device comprising a first mounting element and a first extended region, wherein the first mounting element is disposed within the first recess and the first extended region is disposed within the second recess, and wherein the first extended region is configured to reflect an optical signal through the device and dielectric layer.