Stress sensing element having diaphragm with vertical protrusions
AssigneeAsia Pacific Microsystems, Inc.
InventorsJerwei Hsieh, Hung-Lin Yin, Jr-Wei Chang
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AssigneeAsia Pacific Microsystems, Inc.
InventorsJerwei Hsieh, Hung-Lin Yin, Jr-Wei Chang
Estimating the term…
A stress sensing element comprises a substrate, a structured silicon layer, a substrate connection layer attached to the substrate and the structured silicon layer, and a top silicon layer. The substrate comprises one or more through holes. The structured silicon layer comprises one or more protrusion elements, an outer frame, and a cavity connected to the one or more through holes of the substrate. The top silicon layer comprises a supported region, a suspended region, and one or more stress sensing units. The supported region of the top silicon layer is supported by the outer frame of the structured silicon layer. The suspended region comprises a diaphragm. The one or more stress sensing units sense stresses in the suspended region. The one or more protrusion elements of the structured silicon layer are attached to the diaphragm of the suspended region of the top silicon layer.
A stress sensing element comprising:
A stress sensing element
Dependencies are inferred from the claim text.