Systems and methods for removing contaminants in electroplating systems
AssigneeApplied Materials, Inc.
InventorsKwan Wook Roh, Paul McHugh, Sam Lee, Kyle M. Hanson, Marvin L. Bernt, Bioh Kim
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Abstract
Electroplating systems according to the present technology may include a two-bath electroplating chamber including a separator configured to provide fluid separation between a first bath configured to maintain a catholyte during operation and a second bath configured to maintain an anolyte during operation. The system may include a catholyte tank fluidly coupled with the first bath of the two-bath electroplating chamber. The system may also include a contaminant retrieval system configured to remove contaminant ions from the catholyte.
Claims20
A method of removing copper contaminants from a tin-containing catholyte within an electroplating system, the method comprising:
- flowing the tin-containing catholyte from an electroplating chamber to a catholyte tank;
- passing the tin-containing catholyte across a tin-containing material;
- and
- reducing a copper contaminant concentration in the tin-containing catholyte.
A method of removing copper contaminants from a tin-containing catholyte within an electroplating system, the method comprising:
- flowing the tin-containing catholyte from an electroplating chamber to a catholyte tank, wherein the catholyte tank comprises an anode-cathode pair of electrically coupled electrodes;
- applying a voltage to the anode-cathode pair of electrically coupled electrodes;
- and
- reducing a copper contaminant concentration from the tin-containing catholyte.
A method of removing copper contaminants from a tin-containing catholyte within an electroplating system, the method comprising:
- flowing the tin-containing catholyte from an electroplating chamber to a catholyte tank, wherein the catholyte tank comprises an anode-cathode pair of electrically coupled electrodes;
- applying a first voltage to the anode-cathode pair of electrically coupled electrodes for a first period of time;
- subsequent to the first period of time, increasing the first voltage to a second voltage;
- applying the second voltage to the anode-cathode pair of electrically coupled electrodes for a second period of time;
- and
- reducing a copper contaminant concentration from the tin-containing catholyte.
Dependencies are inferred from the claim text.