Self-filling method for high-aspect-ratio microvias in substrate
AssigneeGuangdong University of Technology
InventorsYu ZHANG, Yutao LI, Weizhong HUANG, Guannan YANG, Guanghan HUANG, Chengqiang CUI
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Abstract
A self-filling method for high-aspect-ratio microvias of a substrate is provided, in which the substrate is activated with a coupling agent; a pasty nano-filler is applied onto a surface of the substrate, where the microvias in the substrate are self-filled with the pasty nano-filler through capillary action, the pasty nano-filler has a wetting angle of α≤30°, and each of the microvias has an aspect ratio of 5-500:1 and a diameter of 1-100 μm; and the coated substrate is subjected to sintering treatment.
Claims10
A self-filling method for high-aspect-ratio microvias of a substrate, comprising:
- (1) activating the substrate with a coupling agent to obtain an activated substrate;
- (2) applying a pasty nano-filler on a surface of the activated substrate;
- wherein microvias in the activated substrate are self-filled with the pasty nano-filler through capillary action, the pasty nano-filler has a wetting angle of α≤30°, and each of the microvias has an aspect ratio of 5-500:1 and a diameter of 1-100 μm;
- and
- (3) subjecting a nano-filler-coated substrate obtained in step (2) to sintering treatment.
Dependencies are inferred from the claim text.