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US 2026/0035563 A1Published application
Polysiloxane filler treating agent and compositions prepared therewith
AssigneesDow Global Technologies LLC, Rohm and Haas Company, Dow Silicones Corporation
InventorsMatthew Carter, Hai Wang, Hongyun Xu, Dan Zhao, Elena Montoto Blanco, Tzu-Chi Kuo
Life of this patent
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Abstract
The present invention relates to a composition comprising a) a polyorganosiloxane; b) filler particles; and c) a filler treating agent of Formula (I): (I) where R1, R1′, R2, R2′, m, n, p, and q are as defined herein. The composition is useful as a thermally conductive formulation.
Claims8
A composition comprising:
- a) a polyorganosiloxane;
- b) filler particles;
- and
- c) a filler treating agent of Formula I:
- where m is from 5 to 150;
- n is from 0.1 to 5;
- p is from 0 to 5;
- q is from 1 to 6;
- X is S or NR6;
- each R1 is independently C1-C6-alkyl, vinyl, phenyl, or benzyl;
- each R1′ is independently C1-C6-alkyl;
- R2 is:
- R2′ is:
- where R3 is H or methyl;
- each R4 is independently C1-C6-alkyl;
- a is an integer of 1 to 3;
- R5 is C1-C12-alkyl, R6 is H or C1-C6 alkyl, and the dashed line represents the point of attachment to X;
- wherein the polyorganosiloxane has degree of polymerization in the range of from 40 to 800.
15 more elements
Dependencies are inferred from the claim text.