Back to results
US 2026/0035560 A1Published application
Resin composition and article made therefrom
AssigneeElite Material Co., Ltd.
InventorChen-Yu HSIEH
Life of this patent
Estimating the term…
Abstract
A resin composition includes 100 parts by weight of a thermosetting resin, 10 parts by weight to 40 parts by weight of a fluorene-containing compound and 210 parts by weight to 400 parts by weight of silica. The resin composition may be used to make various articles, including a resin film, a prepreg, a laminate or a printed circuit board, and at least one or more of the following properties can be improved, including PCT water absorption ratio, dielectric constant, dissipation factor, copper foil peeling strength, thermal conductivity and glass transition temperature.
Claims11
A resin composition, comprising:
- 100 parts by weight of a thermosetting resin;
- 10 parts by weight to 40 parts by weight of a fluorene-containing compound;
- and
- 210 parts by weight to 400 parts by weight of silica;
- wherein the fluorene-containing compound has a structure of Formula (1), and n is between 0 and 2:
- the thermosetting resin comprises a vinyl group-containing polyphenylene ether resin, a maleimide resin, a styrene-based compound or a combination thereof, wherein the styrene-based compound has a structure of Formula (2), and w is between 1 and 20:
3 more elements
Dependencies are inferred from the claim text.