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US 2026/0035558 A1Published application
Resin composition for cleaning molding machines
AssigneeAsahi Kasei Kabushiki Kaisha
InventorsDaisuke MASAKI, Yuki KUROSU
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AssigneeAsahi Kasei Kabushiki Kaisha
InventorsDaisuke MASAKI, Yuki KUROSU
Estimating the term…
A resin composition for cleaning molding machines that achieves both high cleaning power for the material mold-processed before cleaning and easy replacement to the material to be mold-processed after cleaning, improves stable raw material feedability, has metered purging suitability, and has improved workability by suppressing spurt and emission of fume from a molding machine during the cleaning process is provided. To achieve the object, the present disclosure is a resin composition for cleaning molding machines including a thermoplastic resin (A), a synthetic wax (B), and a polyolefin-based resin (C), wherein an absolute value of a difference between solubility parameters of (A) and (B) is 2.0 (cal/cm3)1/2 or more and 7.0 (cal/cm3)1/2 or less, a compounding amount of (C) is more than 0.1 mass % and less than 10 mass %, and a glass transition temperature of (C) is higher than −150° C. and lower than 40° C.
A resin composition for cleaning molding machines comprising at least a thermoplastic resin (A), a synthetic wax (B), and a polyolefin-based resin (C), wherein an absolute value of a difference between a solubility parameter δ(A) of the thermoplastic resin (A) and a solubility parameter S(B) of the synthetic wax (B) is 2.0 (cal/cm3)1/2 or more and 7.0 (cal/cm3)1/2 or less, a compounding amount of the polyolefin-based resin (C) is more than 0.1 mass % and less than 10 mass %, and a glass transition temperature of the polyolefin-based resin (C) is higher than −150° C. and lower than 40° C.
Dependencies are inferred from the claim text.