Substrate processing apparatus and control method of substrate processing apparatus

A substrate processing apparatus, comprising:

• a chamber;
• a stage in the chamber and configured to accommodate a substrate;
• an upper electrode in the chamber and configured to provide plasma on the stage;
• a vacuum pump connected to the chamber and configured to provide negative pressure to the chamber;
• and
• a controller,
• wherein the vacuum pump comprises:
• a pipe assembly connected to the chamber, the pipe assembly comprising a first pipe, a plurality of second pipes, a common pipe connected to the first pipe and the plurality of second pipes, a first valve provided on the first pipe, a plurality of second valves respectively provided on the plurality of second pipes, and a body surrounding the first pipe and the plurality of second pipes;
• an intake port connected to the pipe assembly;
• and
• a pump connected to the intake port and configured to provide negative pressure,
• wherein the body comprises a center region and a second region around the center region, and
• wherein a first end of the first pipe is provided on the center region of the body, and first ends of each of the plurality of second pipes are provided on the second region of the body.

A control method of a substrate processing apparatus, comprising:

• receiving uniformity data of a substrate;
• determining a valve open/close value based on the received uniformity data and valve data;
• and
• adjusting a degree of opening and closing of a first valve and a plurality of second valves based on the determined valve open/close value,
• wherein a first end of the first valve is provided in a central region of a pipe assembly, and first ends of each of the plurality of second valves are provided around the first valve.