Packaged multi-layer piezoelectric substrate acoustic wave device with insulator for reduced dc leakage

A packaged multi-layer piezoelectric substrate acoustic wave device comprising:

• a multi-layer piezoelectric substrate including a piezoelectric layer, a support substrate, a conductive via extending at least partially through the support substrate, and a terminal in electrical communication with the conductive via;
• a dielectric cap structure coupled to the multi-layer piezoelectric substrate by way of a conductive pillar;
• and
• an acoustic wave element positioned between the multi-layer piezoelectric substrate and the cap structure, the acoustic element electrically connected to the terminal through an electrical pathway including the conductive via and the conductive pillar.

A method of forming a packaged multi-layer piezoelectric substrate acoustic wave device, the method comprising:

• providing a multi-layer piezoelectric substrate including a piezoelectric layer, a support substrate, a conductive via extending at least partially through the support substrate, and a terminal in electrical communication with the conductive via;
• electrically connecting an acoustic wave element to the terminal through an electrical pathway including the conductive via;
• coupling a cap structure to the multi-layer piezoelectric substrate so as to position the acoustic wave element between the multi-layer piezoelectric substrate and the cap structure;
• and
• providing an insulator at least partially between the support substrate and the electrical pathway.