Electroplated part, method for manufacturing electroplated part and connector
AssigneeTyco Electronics (Shanghai) Co., Ltd.
InventorsZhenyu (Julie) Zhu, Keke Gan, Zhongxi Huang, Jialin Zhang
Life of this patent
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Abstract
An electroplated part includes a substrate, a nickel plating layer formed on a surface of the substrate, a tin-graphite composite plating layer formed on the nickel plating layer, and a tin plating layer formed on the tin-graphite composite plating layer. The nickel plating layer is a base plating layer of the substrate. The tin plating layer is an outer plating layer of the substrate and the tin-graphite composite plating layer is an intermediate plating layer of the substrate.
Claims19
An electroplated part, comprising:
- a substrate;
- a nickel plating layer formed on a surface of the substrate, the nickel plating layer is a base plating layer of the substrate;
- a tin-graphite composite plating layer formed on the nickel plating layer;
- and
- a tin plating layer formed on the tin-graphite composite plating layer, the tin plating layer is an outer plating layer of the substrate and the tin-graphite composite plating layer is an intermediate plating layer of the substrate.
A method for manufacturing an electroplated part, comprising the steps of:
- providing a substrate;
- forming a nickel plating layer on the substrate, the nickel plating layer is a base plating layer of the substrate;
- forming a tin-graphite composite plating layer on the nickel plating layer;
- and
- forming a tin plating layer on the tin-graphite composite plating layer, the tin plating layer is an outer plating layer of the substrate and the tin-graphite composite plating layer is an intermediate plating layer of the substrate.
A connector, comprising:
- a housing;
- and
- an electroplated part disposed in the housing as a terminal of the connector, the electroplated part includes a substrate, a nickel plating layer formed on a surface of the substrate, the nickel plating layer is a base plating layer of the substrate, a tin-graphite composite plating layer formed on the nickel plating layer, a tin plating layer formed on the tin-graphite composite plating layer, the tin plating layer is an outer plating layer of the substrate and the tin-graphite composite plating layer is an intermediate plating layer of the substrate.
Dependencies are inferred from the claim text.