Pattern inspection system and method of pattern inspection using the same

A computing device, comprising:

• a memory configured to store one or more instructions;
• and
• at least one processor configured to execute the one or more instructions stored in the memory to:
• receive a first scanning electron microscope (SEM) image from a scanning electron microscope configured to detect electrons emitted from a first wafer based on electron beam being emitted onto the first wafer;
• generate a first SEM image comprising a plurality of pixels based on the detected electrons;
• and
• determine, based on a period of a pattern extracted from the first SEM image, a pixel size of a second SEM image with respect to a second wafer to be generated by the SEM.

A method of pattern inspection, the method being executed by at least one processor, the method comprising:

• receiving a first scanning electron microscope (SEM) image from a scanning electron microscope configured to detect electrons emitted from a first wafer based on first electron beam being emitted onto the first wafer;
• generating a first SEM image comprising a plurality of pixels based on the detected electrons;
• and
• determining, based on a period of a pattern extracted from the first SEM image, a pixel size of a second SEM image with respect to a second wafer to be generated by the SEM.