Co-packaged optics chip module
AssigneeCentera Photonics Inc.
InventorsChin-Ta Chen, Kao-Feng Tsai
Life of this patent
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Abstract
A co-packaged optics chip module includes a silicon substrate, a silicon-organic-hybrid modulator, a driving element, a photodetector, and an amplifier. The silicon-organic-hybrid modulator is disposed on the silicon substrate. The driving element is disposed on the silicon substrate and is electrically connected to the silicon-organic-hybrid modulator. The photodetector is disposed on the silicon substrate. The amplifier is disposed on the silicon substrate and is electrically connected to the photodetector. The silicon-organic-hybrid modulator and the photodetector are integrated on the silicon substrate.
Claims7
A co-packaged optics chip module, comprising:
- a silicon substrate;
- a silicon-organic-hybrid modulator, disposed on the silicon substrate;
- a driving element, disposed on the silicon substrate and electrically connected to the silicon-organic-hybrid modulator;
- a photodetector, disposed on the silicon substrate;
- and
- an amplifier, disposed on the silicon substrate and electrically connected to the photodetector;
- wherein, the silicon-organic-hybrid modulator and the photodetector are integrated on the silicon substrate.
Dependencies are inferred from the claim text.