Optical chip, photoelectric conversion apparatus, co-packaged optics chip, and optical communication device
AssigneeHuawei Technologies Co., Ltd.
InventorsWenqi Zhang, Pengcheng Xiao
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AssigneeHuawei Technologies Co., Ltd.
InventorsWenqi Zhang, Pengcheng Xiao
Estimating the term…
An optical chip includes an optical fiber connector, a photonic integrated circuit PIC, a protective housing, and an injection molding layer. The protective housing is located between the injection molding layer and the PIC, and coupling space is formed between the protective housing and the PIC. The optical fiber connector includes an optical fiber. The optical fiber connector has a first connection end that faces the PIC and a second connection end that is away from the PIC. A first coupling end of the optical fiber passes through the first connection end. The first coupling end and a second coupling end of an optical waveguide of the PIC both extend into the coupling space, and the first coupling end located in the coupling space is coupled to the second coupling end. The second connection end is configured to detachably connect to another optical fiber connector.
An optical chip, comprising:
A photoelectric conversion apparatus, comprising:
An optical communication device, comprising:
Dependencies are inferred from the claim text.