Photonic chip structure and semiconductor package including the same
AssigneeSamsung Electronics Co., Ltd.
InventorsJung Hua CHANG, Jing Cheng LIN
Life of this patent
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AssigneeSamsung Electronics Co., Ltd.
InventorsJung Hua CHANG, Jing Cheng LIN
Estimating the term…
A photonic chip structure may include: an electronic integrated circuit chip; a connection terminal connected to the electronic integrated circuit chip; an optical integrated circuit chip under the electronic integrated circuit chip and the connection terminal in a vertical direction and including a photonic integrated circuit (PIC) connection pad and a first PIC insulating layer on the PIC connection pad, the PIC connection pad connected to the connection terminal; and an optical block spaced apart from the electronic integrated circuit chip in a horizontal direction and configured to provide a path for optical signals to the optical integrated circuit chip, wherein the first PIC insulating layer includes a first cavity, and the optical block is in the first cavity.
A photonic chip structure comprising:
A photonic chip structure comprising:
A semiconductor package comprising:
Dependencies are inferred from the claim text.