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US 2026/0029437 A1Published application
Power Module
AssigneesHyundai Motor Company, Kia Corporation
InventorsDong Hwan Lee, Suk Hyun Lim, Han Jin Do
Life of this patent
Estimating the term…
Abstract
A power module is configured to provide sensing current through a Hall element. By sensing current through a Hall element, reducing the volume and cost for current sensing can be provided. In addition, by reducing the influence of eddy currents on the Hall element, the sensing accuracy of the Hall element may be improved.
Claims20
A power module comprising:
- a substrate provided with a semiconductor chip and a plurality of metal parts;
- a sensor part disposed on a first side of the substrate where the semiconductor chip is located and configured to sense current flowing in the semiconductor chip or the metal part of the first side;
- and
- an eddy current reduction pattern part including a plurality of segments in which at least one of the plurality of metal parts is divided to reduce an eddy current around the sensor part.
1 more element
Dependencies are inferred from the claim text.