Low thermal impedance phase change thermal interface materials
AssigneeHoneywell International Inc.
InventorsKai Wang, Lu Xiao, Shiming He, Qian Yang
Life of this patent
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Abstract
A phase change thermal interface material including a thermally conductive filler, a phase change wax, a coupling agent, and a polymer matrix material. The thermally conductive filler includes from about 50 wt. % to about 70 wt. % aluminum powder; from about 19 wt. % to about 30 wt. % aluminum oxide; and from about 1 wt. % to about 9 wt. % zinc oxide, based on the total weight of the phase change thermal interface material. The phase change thermal interface material has a thermal impedance from about 0.02° Ccm2/W to about 0.04° Ccm2/W, as determined by ASTM D5470.
Claims20
A phase change thermal interface material, comprising:
- a thermally conductive filler;
- wherein the thermally conductive filler comprises:
- from about 50 wt. % to about 70 wt. % of aluminum powder;
- from about 19 wt. % to about 30 wt. % of aluminum oxide;
- and
- from about 1 wt. % to about 9 wt. % zinc oxide, based on the total weight of the phase change thermal interface material;
- a phase change wax;
- a coupling agent;
- and
- a polymer matrix material;
- wherein the phase change thermal interface material has a thermal impedance from about 0.02° C.cm2/W to about 0.04° C.cm2/W, as determined by ASTM D5470.
An electronic component comprising:
- a heat sink;
- an electronic chip;
- and
- a phase change thermal interface material positioned between the heat sink and the electronic chip, wherein the phase change thermal interface material comprises:
- a thermally conductive filler, the thermally conductive filler comprising at least one of:
- from about 50 wt. % to about 70 wt. % aluminum powder;
- from about 19 wt. to about 30 wt. % aluminum oxide;
- and
- from about 1 wt. % to about 9 wt. % zinc oxide, based on the total weight of the phase change thermal interface material;
- a phase change wax;
- a coupling agent;
- and
- a polymer matrix material;
- wherein the phase change thermal interface material has a thermal impedance from about 0.02° C.cm2/W to about 0.04° C.cm2/W, as determined by ASTM D5470.
A method for applying a phase change thermal interface material to a substrate, comprising:
- combining each of a thermally conductive filler, a phase change wax, a coupling agent, and a polymer matrix material, to form the phase change thermal interface material;
- wherein the thermally conductive filler comprises:
- from about 50 wt. % to about 70 wt. % aluminum powder;
- from about 19 wt. % to about 30 wt. % aluminum oxide;
- and
- from about 1 wt. % to about 9 wt. % zinc oxide, based on the total weight of the phase change thermal interface material;
- combining the phase change thermal interface material with a solvent to form a phase change thermal interface material paste;
- and
- applying the phase change thermal interface material paste to a metal substrate.
Dependencies are inferred from the claim text.