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US 2026/0027818 A1Published application
Debonding apparatus, debonding system, and debonding method
AssigneeYokogawa Electric Corporation
InventorSyuhei Okada
Life of this patent
Estimating the term…
Abstract
A debonding apparatus includes a debonder and a controller that are located inside an object including multiple adhered members adhered by an adhesive member. The debonder is configured to be operatable to debond the adhesive member by acting on the adhesive member. The controller is configured to activate the debonder, based on a debonding instruction received from a terminal apparatus located outside the object.
Claims11
A debonding apparatus comprising:
- at least one debonder and a controller that are located inside an object including multiple adhered members adhered by an adhesive member,
- wherein
- the debonder is configured to be operatable to debond the adhesive member by acting on the adhesive member, and
- the controller is configured to activate the debonder, based on a debonding instruction received from a terminal apparatus located outside the object.
1 more element
A debonding system comprising:
- at least one debonding apparatus;
- and
- a terminal apparatus configured to wirelessly power the at least one bonding apparatus and transmit a debonding instruction to the at least one debonding apparatus,
- wherein
- the debonding apparatus includes at least one debonder and a controller that are located inside an object including multiple adhered members adhered by an adhesive member,
- the debonder is configured to be operatable to debond the adhesive member by acting on the adhesive member, and
- the controller is configured to activate the debonder, based on the debonding instruction received wirelessly from the terminal apparatus located outside the object.
4 more elements
A debonding method comprising:
- activating a debonder based on a debonding instruction received from a terminal apparatus, the debonder being located inside an object including multiple adhered members adhered by an adhesive member, and configured to be operatable to debond the adhesive member by acting on the adhesive member, the terminal apparatus being located outside the object.
Dependencies are inferred from the claim text.